Package-on-Package (PoP) Technology
- Demand for handheld, high functionality products increasing
- Component pitch and size reaching limits of current assembly process
- Increasing signal processing performance and memory capabilities
- Board space utilisation
- Convergence of communications, computing and consumer electronics functions driving demands for greater functionality
- Cost reduction
If engineers cannot increase the size of the circuit board or shrink the components, they have nowhere else to go but up. Stacking one chip on top of another makes the most of board real estate, while also reducing signal noise and increasing processing speed.
 In simple terms POP represents the stacking of components one on top of the other during original component manufacture or during printed board assembly.
Package-on-Package (PoP) is designed to vertically combine discrete logic and memory Ball Grid Array (BGA) packages. Two packages rest on top of one another, with a standard interface to route signals between them.
- Enhanced performance
- Better space utilisation
- Shorter distances for electrical signals to travel
- Less high frequency interference
- Processor and memory can be combined freely
- Greater flexibility during system design, simplified system design
- Simpler signal routing and reduced pin-count can improve signal integrity and reduce the complexity of the PCB layout
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