PCB Assembly - Soldering
There are many ways to solder SMT components. Axiom utilises highly accurate enclosed head, solder paste, screen printing systems (Proflow) with automated 2-D inspection at the input to the SMT process.
This system gives high levels of consistency for both paste and pump print stencil screening.
Benefits of Proflow are:-
- Efficient materials transfer
- Superior throughput rate
- Higher process yields
- Lower material consumption
- and improved process control
Because the material is contained in a sealed environment, as opposed to being exposed to air as in traditional squeegee applications, enclosed head printing affords the environmental and cost saving benefits of lower material waste.
Additionally a highly accurate laser scanning 3-D monitoring system is used for applied paste volume analysis, utilising statistical process control through the manufacturing cycle.
Solder paste stencil hygiene is critical to ensure consistency of the application process, a programmable, ultrasonic system with air jet drying, providing automatic solder particle filtration is deployed during each product/line changeover.
Soldering is either with regular tin/lead solder, or lead free as requested by customer.
Axiom works closely with customers to help with the transition into lead free soldering of their product. Click here to see our section on RoHS.
