X-Ray Inspection
X-ray inspection allows us to identify potential product quality issues non-destructively.
Benefits include:-
- Design evaluation
- Process improvement
- Quality assessment
- Rework verification
- Fault detection
- Failure analysis
- Improve quality and yield
- Reduce scrap
- and a reduction in warranty returns
Axiom’s investment in the latest X-Ray integrated digital acquisition technology is recognised as a vital cog in the test regime for the manufacture of printed circuit board assemblies.
The Dage XD7500VR X-Ray inspection system enables enhanced analytical quality at a faster throughput using sub-micron minimum feature recognition providing superb image quality for BGA, flip chip and chip scale package inspection on printed circuit boards as well as semiconductor devices.
By providing highly improved digital real-time X-Ray images, enhanced resolution, image manipulation, extensive greyscale definition and oblique angle views of up to 70 degrees, the highest levels for investigation of joint quality can be assured.
Capabilities include:
- Automated inspection routines
- Automatic BGA and die-void measurements
- Real-time digital X-ray inspection
- 16-bit image processing
- 1.3M pixel enhanced resolution
- >65,000 greyscale levels
- 950nm feature recognition
- 70 degrees oblique views
- 360 degrees rotating view
- Comprehensive data recording
